150
EPSON
S1C63666 TECHNICAL MANUAL
CHAPTER 9: PAD LAYOUT
CHAPTER
9 P
AD
L
AYOUT
9.1 Diagram of Pad Layout
Chip thickness: 400 µm
Pad opening:
85 µm
X
Y
(0, 0)
4.75 mm
4.95 mm
1
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
125
130
135
Die No.