System component description
37
Overview
DAE description
Each DAE consists of the following components:
◆
Drive carrier
◆
Disk drives
◆
Midplane
◆
Link control cards (LCCs)
◆
Power supply/cooling modules
◆
EMI shielding
Drive carrier
Disk drive carriers are plastic assemblies that provide smooth, reliable contact with the
enclosure slot guides and midplane connectors. Each carrier has a handle with a latch and
spring clips. The latch holds the disk drive in place to ensure proper connection with the
midplane.
shows the disk drive ready LEDs that are integrated into
the chassis that the carrier is in. These LEDs primarily show the disk drive readiness as
well as activity.
Disk drives
You can visually distinguish between drive types by their different latch and handle
mechanisms and by the type, capacity, and speed labels on each drive. You can add or
remove a disk drive while the DAE is powered up, but you should exercise special care
when removing drives while they are in use. Disk drives are extremely sensitive electronic
components. For more information about the supported disk drives for the VNXe3150,
refer to the
EMC
®
VNXe™ Series Storage Systems Disk and OE Matrix
document.
Midplane
A midplane separates the front-facing disk drives from the rear-facing LCCs and power
supply/cooling modules. It distributes power and signals to all components in the
enclosure. LCCs, power supply/cooling modules, and disk drives plug directly into the
midplane.
Table 18 DPE and DAE configuration rules for single SP configuration
VNXe3150 Single SP platform
DPE
DAE1
DAE2
DAE3
DAE4
DAE5
DAE6
DAE7
Total
12
12
12
12
X
X
X
X
48
12
12
25
X
X
X
X
X
49
12
25
12
X
X
X
X
X
49
25
25
X
X
X
X
X
X
50
25
12
12
X
X
X
X
X
49