EMC2 VNXe 3300 System, Hardware Installation Manual, Page: 3 / 20

Device placement guidelines
EMC VNXe™3300 System Hardware Installation Guide for Telco Racks
5
Device placement guidelines
Before attaching the mounting trays to the Telco rack, you must decide where to put them.
Where you install the devices depends on the kinds of devices that you will install.
Position in rack
Devices with internal cooling fans that move air from front to back (or vice versa) and not
from beneath or above have no special cooling requirements that direct placement in the
rack. All of the storage systems and enclosures mentioned in this document have fans
that move air from front to back.
DAEs should be installed above DPEs to facilitate cable routing in the rear of the Telco
rack.
Device dimensions
Dimensions and weights for VNXe3300 system devices are listed in the
Technical
Specifications and Operating Limits
document for the system, available on the EMC
Online Support website at:
http://www.emc.com/vnxesupport
Power considerations
Power distribution must support the number of outlets required for the device (2 per
enclosure) and the device power rating. Power specifications for VNXe series system
components are listed in the
Hardware Overview
document for each system, available on
the EMC Online Support website at:
http://www.emc.com/vnxesupport
For high availability, a VNXe3300 system requires at least two discrete site power circuits.
Each power supply or power/cooling module in an enclosure should connect to a separate
power distribution unit and power source; power supplies in any component should not
share a power source.
Figure 2 on page 6 shows an example AC power connection configuration.