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electrostatic susceptibility;
Please ensure the humidity is within limited range, some parts are sensitive to humidity;
Please avoid using modules under too high or too low temperature.
8.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify
frequency and channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is high.
9 Welding instruction
9.1 Reflow soldering temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time
（
tL
）
Maintained Above
（
TL
）
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
220-235℃
230-250℃
Aveage ramp-down rate
（
Tp to Tsmax
）
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max
