Chengdu Ebyte Electronic Technology Co.,Ltd.
E104-BT40 User Manual
Copyright ©2012–2019
，
Chengdu Ebyte Electronic Technology Co.,Ltd.
9-29
9. Welding operation guidance
9.1 Reflow Soldering Temperature
Profile Feature
Curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Minimum preheating
temperature
100
℃
150
℃
Preheat temperature max (Tsmax)
Maximum
preheating
temperature
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Liquid phase temperature
183
℃
217
℃
Time
（
tL
）
Maintained Above
（
TL
）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
Peak temperature
220-235
℃
230-250
℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Average descent rate
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
Time of 25 ° C to peak
temperature
6 minutes max
8 minutes max
9.2 Reflow Soldering Curve
