Chengdu Ebyte Electronic Technology Co.,Ltd
E104-BT30-TB1 User Manual
Copyright ©2012–2019
，
Chengdu Ebyte Electronic Technology Co.,Ltd
6-9
the lower the transmit power is.
5.2 Module is easy to damage
Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will
lead to a permanent damage to the module.
Please check the stability of power supply and ensure the voltage not to fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range for some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6. Welding guidance
6.1 Reflow Soldering Temperature
Profile Feature
Curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Minimum preheating
temperature
100
℃
150
℃
Preheat temperature max (Tsmax)
Maximum preheating
temperature
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Liquid phase temperature
183
℃
217
℃
Time
（
tL
）
Maintained Above
（
TL
）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
Peak temperature
220-235
℃
230-250
℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Average descent rate
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
Time of 25 ° C to peak
temperature
6 minutes max
8
minutes max
