Chengdu Ebyte Electronic Technology Co.,Ltd.
E103-W10 User Manual
Copyright ©2012–2021
,
Chengdu Ebyte Electronic Technology Co.,Ltd.
19
9 Production guidance
9.1 Reflow soldering temperature
9.2 Reflow soldering curve
10 Related module
Model No.
Core IC
Frequency (Hz)
Tx power(dBm)
Distance(km)
Size(mm) Package
Interface
E103-W01
ESP8266EX
2.4G
20
0.1
16*24
SMA
TTL
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
(
Tsmin
)
100
℃
150
℃
Preheat temperature max (Tsmax)
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
183
℃
217
℃
Time
(
tL
)
Maintained Above
(
TL
)
60-90 sec
30-90 sec
Peak temperature
(
Tp
)
220-235
℃
230-250
℃
Aveage ramp-down rate
(
Tp to Tsmax
)
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
6 minutes max
8 minutes max