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Chengdu Ebyte Electronic Technology Co.,Ltd.
E103-W07 User Manual
Copyright ©2012–2021
,
Chengdu Ebyte Electronic Technology Co.,Ltd.
35
8 Welding operation guidance
8.1 Reflow temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
(
Tsmin
)
Minimum preheating temperature
100
℃
150
℃
Preheat temperature max (Tsmax)
Maximum preheating temperature
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheat time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ascent rate
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Liquidus temperature
183
℃
217
℃
Time
(
tL
)
Maintained Above
(
TL
)
Time above liquidus
60-90 sec
30-90 sec
Peak temperature
(
Tp
)
Peak temperature
220-235
℃
230-250
℃
Aveage ramp-down rate
(
Tp to Tsmax
)
Average descent rate
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
Time from 25
℃
to peak temperature
6 minutes max
8
minutes max
8.2 Reflow soldering curve