Eaton XP-503, User Manual

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4 Installation
4.4 Installing
20
XP-503
12/2014 MN048014-EN www.eaton.com

The following requirements and instructions must be observed without fail in order to
ensure that the XP-503 will run properly and will not be damaged.
4.4.1 Temperature

Prior to commissioning:
-
Slowly let the device settle into the existing ambient temperature.
-
If there is condensation in or on the device, do not switch on the device until it is completely dry.

Avoid overheating during operation:
Do not expose the device to direct sunlight or other sources of heat.

The ambient air temperature during operation must not exceed the maximum limit value specified
in the "Technical data" chapter.
4.4.2 Aeration and de-aeration

Do not block the ventilation openings when mounting the device:
They are designed to allow air to circulate in order to cool the device.

The device uses natural convection-based passive cooling, i.e., it does not use CPU or system
fans.

The CPU and the power supply unit's power semiconductors are directly thermally connected to
the back of the display housing by means of a heat spreader or heat sink.

Make sure that there will be enough volume for air changes inside the control panel, etc. There
must be a clearance of at least 50 mm around the XP-503. The clearance behind it can be
reduced to 20 mm if necessary.

Make sure that there is enough air recirculation.
Example: XP-503-15
The following also applies to other device versions as applicable.
Abb. 1 Aeration and de-aeration