DigitAx User Guide
Issue code: dgxu4
4-2
4.2
Planning the installation
The following conditions must be met when
planning the installation of the Drive or a number of
Drives in an enclosure:
•
The environment is acceptable
•
The maximum permissible ambient
temperature is not exceeded
•
The
EMC
requirements are met
•
The electrical installation meets safety
requirements
•
The size of the installation does not
exceed the space available
Use the following procedure:
1.
Decide how the Drives are to be mounted in the
enclosure, as follows:
•
Surface-mounted
•
Through-panel mounted
Surface mounting gives the following:
Better ingress protection
Heat dissipated inside the enclosure
Through-panel mounting gives the following:
Heat dissipated outside the enclosure
Reduced ingress protection
2.
Refer to Figure 4–1 to plan the layout of the
equipment in the enclosure.
3.
If the Drives are to be surface mounted in the
enclosure, refer to either of the following:
If the enclosure is to be sealed, perform the
calculations in
Heat dissipation in a sealed
enclosure
in order to determine the minimum
permissible size of enclosure for heat
dissipation.
If the enclosure is to be ventilated, perform the
calculation in
Heat dissipation in a ventilated
enclosure
in order to determine the required
volume of air-flow.
4.
If necessary, adjust the size of the enclosure,
and re-plan the internal equipment accordingly.
Repeat instructions
2
to
4
as many times as
required to meet all the requirements.
Summary of Contents for DBE1100S
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