MB95710M Series
MB95770M Series
Document Number: 002-09307 Rev. *D
Page 29 of 172
(2) Be sure that abnormal current flows do not occur during the power-on sequence.
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Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from electromag-
netic interference, etc. Customers are requested to observe applicable regulations and standards in the design of
products.
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Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss
from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire
protection, and prevention of over-current levels and other abnormal operating conditions.
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Precautions Related to Usage of Devices
Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other
office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation
may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability
are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls,
medical devices for life support, etc.) are requested to consult with sales representatives before such use. The
company will not be responsible for damages arising from such use without prior approval.
8.2 Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during
soldering, you should only mount under Cypress’s recommended conditions. For detailed information about mount
conditions, contact your sales representative.
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Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering
on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and
using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually
causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting
processes should conform to Cypress recommended mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to
contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts
and IC leads be verified before mounting.
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Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more
easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased
susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established
a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Cypress
ranking of recommended conditions.
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Lead-Free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering,
junction strength may be reduced under some conditions of use.
