soldering & handling
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and
XLamp
®
are registered trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification.
For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree Sales at sales@cree.
com. Other trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor
endorsement, sponsorship or association.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
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LD
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P
32
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Cree
®
XLamp
®
MX Family LEDs
IntroDuCtIon
This application note applies to the XLamp
®
MX Family of LeDs,
which have order codes in the following format:
MX6xxx-xx-xxxx-xxxxxx
MX3xxx-xx-xxxx-xxxxxx
This application note explains how XLamp MX Family of LeDs
and assemblies containing these LeDs should be handled during
manufacturing. Please read the entire document to understand
how to properly handle XLamp MX LeDs.
tabLE oF ContEnts
MX Family LeDs.............................................2
Circuit Board Preparation & Layouts ...........................................3
Case Temperature (T
) Measurement Point ...............................4
MX Family LeDs ...........................4
Low Temperature Operation ........................................................7
XLamp
MX Family LED Reflow Soldering Characteristics
Chemicals & Conformal Coatings ...............................................9
Assembly Storage & Handling ...................................................10
Tape and Reel .............................................................................11
Packaging & Labels ...................................................................12
