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CHEMICaLs & ConForMaL CoatIngs

Below are representative lists of chemicals and materials to be used or avoided in LeD manufacturing activities. For a complete and 
current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s 

Chemical Compatibility Application 

Note

The video at 

www.youtube.com/watch?v=t24bf9D_1SA

 illustrates the process Cree has developed for testing the compatibility of 

chemicals and materials with LeDs. You should also consult your regional Cree Field Applications engineer.

recommended Chemicals

In testing, Cree has found the following chemicals to be safe to use with XLamp ML family LeDs.

• 

Water

• 

Isopropyl alcohol (IPA)

Chemicals tested as Harmful

In general, subject to the specifics in Cree’s 

Chemical Compatibility Application Note

, Cree has found certain chemicals to be harmful to 

XLamp ML family LeDs. Cree recommends not using these chemicals anywhere in an LeD system containing XLamp ML family LeDs. The 
fumes from even small amounts of the chemicals may damage the LeDs.

• 

Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)

• 

Methyl acetate or ethyl acetate (i.e., nail polish remover)

• 

Cyanoacrylates (i.e., “Superglue”)

• 

Glycol ethers (including Radio Shack

®

 Precision electronics Cleaner - dipropylene glycol monomethyl ether)

• 

Formaldehyde or butadiene (including Ashland

®

 PLIOBOND

®

 adhesive)

Hermetically sealing Luminaires

For proper LeD operation and to avoid potential lumen depreciation and/or color shift, LeDs of all types must operate in an environment 

that contains oxygen. Simply allowing the LEDs to ventilate to air is sufficient; no extraordinary measures are required. Hermetically 

sealing LeDs in an enclosed space is not recommended.

potential of silver tarnishing

XLamp ML Family LeDs contain silver-plated parts that may tarnish (turn black) over time when exposed to oxidizing substances such as 
sulfur, chlorine, or other halides. Oxidation of the leads can reduce the ability to make a good solder connection and affect the light output 
of the LeD. exposure to oxidizing substances can come from materials used near the LeD during manufacturing or from the air around 
the LeDs during storage.

To reduce the potential of tarnishing for XLamp ML Family LeDs, Cree recommends that customers minimize exposure of the LeDs 
to oxidizing substances at all times, including storage, manufacturing and product testing. Potential sources of oxidizing substances 

include paper, air filters, some cleaning chemicals, cardboard boxes and rubber anti-static mats.

99

Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree

®

, the Cree logo and XLamp

®

 are registered trademarks of Cree, Inc. Other 

trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided 

for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree 

Sales at [email protected].

9

XLamp

®

 mL FamiLy LED SoLDEring & HanDLing

Summary of Contents for XLamp ML Series

Page 1: ...ree Inc 4600 Silicon Drive Durham NC 27703 USA Tel 1 919 313 5300 www cree com Xlamp CLD AP50 Rev 8B Cree XLamp ML Family LEDs Introduction This application note applies to XLamp ML family LEDs which...

Page 2: ...pick place tool to remove the XLamp ML family LEDs from the factory tape reel packaging Pick Place Nozzle For pick and place nozzles coming into contact with silicone covered LED components Cree recom...

Page 3: ...Stencil Pattern Hatched Area Is Opening Alternative Solder Pad 3 3 Copyright 2010 2018 Cree Inc All rights reserved The information in this document is subject to change without notice Cree the Cree...

Page 4: ...ed in the XLamp ML Family LED Reflow Soldering Characteristics section page 7 Do not wave solder XLamp ML family LEDs Do not hand solder XLamp ML family LEDs N2 reflow is recommended X WRONG P CORRECT...

Page 5: ...g is not necessary after reflow soldering If PCB cleaning is necessary Cree recommends the use of isopropyl alcohol IPA Do not use ultrasonic cleaning Moisture Sensitivity XLamp ML Family LEDs are shi...

Page 6: ...on above Storage Conditions XLamp ML Family LEDs that have been removed from the original MBB packaging but not soldered should be stored in one of the following ways Store the parts in a rigid metal...

Page 7: ...nge without notice Cree the Cree logo and XLamp are registered trademarks of Cree Inc Other trademarks product and company names are the property of their respective owners and do not imply specific p...

Page 8: ...Down Rate 1 6 C second Time 25 C to Peak Temperature 4 minutes max Note All temperatures refer to topside of the package measured on the package body surface Note While the high reflow temperatures ab...

Page 9: ...types must operate in an environment that contains oxygen Simply allowing the LEDs to ventilate to air is sufficient no extraordinary measures are required Hermetically sealing LEDs in an enclosed spa...

Page 10: ...ed The information in this document is subject to change without notice Cree the Cree logo and XLamp are registered trademarks of Cree Inc Other trademarks product and company names are the property o...

Page 11: ...Y XX 25 XXX 125 X 5 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH TOLERANCE UNLESS SPECIFIED SURFACE FINISH 1 6 8 12 1 75 4 1 5 1 65 Trailer Loaded Pockets Leader 2 1 4 000...

Page 12: ...ot Label with Cree Bin Code Qty Lot Vacuum Sealed Moisture Barrier Bag Patent Label Label with Customer Order Code Qty Reel ID PO Humidity Indicator Card inside bag Dessicant inside bag 12 12 Copyrigh...

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