CasE tEMpEraturE (t
s
) MEasurEMEnt poInt
XLamp ML family LeD case temperature (T
s
) should be measured on the PCB surface, as close to the LeD’s thermal pad as possible. This
measurement point is shown in the picture below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp ML LeD itself. In testing, Cree has found such
a solder pad to have insignificant impact on the resulting T
s
measurement.
notEs on soLDErIng XLaMp
®
ML FaMILy LEDs
XLamp ML family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the
PCB on a hotplate and following the reflow soldering profile listed in the XLamp ML Family LED Reflow Soldering Characteristics section
(page 7).
Do not wave-solder XLamp ML family LeDs. Do not hand-solder XLamp ML family LeDs. N
2
reflow is recommended.
X
Wrong
P
CorrECt
P
CorrECt
44
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trademarks of Cree, Inc. Other
trademarks, product and company names are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided
for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please contact Cree
Sales at [email protected].
4
XLamp
®
mL FamiLy LED SoLDEring & HanDLing
