CIRCUIT BOARD PREPARATION & LAYOUTS
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or
soldering XLamp ML family LEDs onto the PCB. The diagram below shows the recommended PCB solder pad layout for XLamp ML family
LEDs.
All dimensions in mm.
For additional information about FR4 thermal vias, illustrated above, consult Cree LED’s
Optimizing PCB Thermal Performance
note.
Recommended FR4 Solder Pad
Recommended MCPCB Solder Pad
MX3535 Pad Layout
Recommended Stencil Pattern
(Hatched Area Is Opening)
MX3535 Pad Layout
Alternative Solder Pad
MX3535 Pad Layout
XLAMP
®
ML FAMILY LED SOLDERING & HANDLING
© 2010-2021 Cree LED. The information in this document is subject to change without notice. Cree
®
and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Wolfspeed, Inc. XLamp
®
is a registered trademark of Cree LED. Other trademarks, product and company names
are the property of their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association. This document
is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available
at www.cree-led.com.
CLD-AP50
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