ZU/ZT-48
ZU/ZT
ZT1R5 ZT3
7 Cleaning
n
Cleaning is possible by below listed conditions.
n
n
During cleaning to drying (the condition that cleaning liquid is
soaked into the ink of name plate), do not touch on the surface of
name plate.
After cleaning, dry them enough.
Cleaning method
No.
Classification
1
2
3
4
Cleaning agents
Pine Alpha ST–100S (ARAKAWA CHEMICAL CO.)
Clean Through 750H (KAO Corporation)
IPA
Asahiklin AK–225AES (ASAHI GLASS CO.)
Water type
Solvent type
No.
1
2
3
4
Cleaning method
Liquid Temp.
Varnishing or Ultra
sonic wave
Less than
60
Period
Within 5
minutes
Within 2
minutes
–
Varnishing,Ultra sonic
wave, Vapor
8 Soldering
n
n
Flow soldering : 260
less than 15 seconds.
Soldering iron : 450
less than 5 seconds.
9 Input/Output Pin
n
n
When too much stress is applied on the input/output pins of the
unit, the internal connection may be weakened. As below Fig.9.1,
avoid applying stress of more than 9.8N (1kgf) on the pins hori-
zontally and more than 19.6N (2kgf) vertically.
When additional stress is expected to be put on the input/output
pins because of vibration or impacts, fix the unit on PCB (using sil-
icone rubber or fixing fittings) to reduce the stress onto the in-
put/output pins.
Less than
9.8N(1kgf)
Less than
9.8N(1kgf)
Less than 19.6N(2kgf)
A part
A
Fig.9.1 Stress onto the pins
10 Peak Current
(Pulse Load)
n
It is possible to supply the pulse current for the pulse load by con-
necting the capacitor externally at the output side.
n
The average current Iav of output is shown in below formula.
(Iop - Is) t
T
Iav = Is +
n
The required electrolytic capacitor C is found by below formula.
(Iop - Iav) t
Vo
C =
Instruction
anual
M
DC-DC Converters PCB Mount type
