Accelnet & Stepnet Plus Panels User Guide
16-01339 Rev 07
4.16 F
AULT
L
EVELS
Amp Over Temperature
> 70 °C
DC Bus Under Voltage
< +14 Vdc
DC Bus Over Voltage
> +90 Vdc
Encoder Power
< +4.25 Vdc
4.17 O
PERATING
T
EMPERATURE AND
C
OOLING
C
ONFIGURATIONS
H
EATSINK AND
F
AN
C
ONFIGURATIONS
The graphics below show the mounting and cooling configurations used to obtain the thermal data for the
drives. The Rth (thermal resistance) is the temperature rise in degrees C per Watt of dissipation in the drive.
The mounting surface is not thermally conducting and does not contribute to the Rth data.
T
HERMAL
R
ESISTANCE VS
.
M
OUNTING
&
C
OOLING
This table shows the thermal resistance Rth in degrees-C per Watt (C/W) for standard mounting and cooling
configurations.
Mounting
Description
BEL, BPL,
BML, TEL
BE2, BP2, TE2, TP2
NHSNF
No HeatSink, No Fan
3.4
2.33
NHSF
No HeatSink, Fan
1.32
0.97
HSNF
HeatSink, No Fan
2.02
1.28
HSF
HeatSink, Fan
0.91
0.57
N
O
H
EATSINK
No Fan (NHS-NF)
With Fan* (NHS-F)
W
ITH
H
EATSINK
No Fan (HS-NF)
With Fan* (HS-F)
