Copyright
©
2018
congatec
GmbH
TSCOm17
14/75
2
Specifications
2.1
Feature List
Table 3 Feature Summary
Form Factor
Based on COM Express™ standard pinout Type 6 Rev. 3.0 (Basic size: 125 mm x 95 mm)
Processor
8th Generation Intel
®
Core i7,i5,i3 and Xeon mobile processors
Memory
Two memory sockets (located on the top and bottom side of the conga-TS370). Supports
-
SO-DIMM non-ECC
1
DDR4 modules
-
Data rates up to 2666 MT/s
-
Maximum 64 GB capacity (32 GB each)
NOTE
: Only variants that feature the Intel CM246 chipset support ECC memory
Chipset
Mobile Intel
®
300 Series Chipset QM370, HM370 and CM246 PCH
Audio
High definition audio interface with support for multiple codecs
Ethernet
Gigabit Ethernet (Intel
®
i219-LM/V controller) with AMT
2
12.0 support
Graphics Options
Intel
®
UHD Gen. 9 (630/P630). Supports:
-
API (DirectX 12, Direct3D 2015, OpenGL 4.5, OpenCL 2.1)
-
Intel
®
QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-
Up to three independent displays (see table 7 “Display Combinations and Resolutions”)
3x DP++
1 PEG Gen 3 port (x16 lanes)
1x LVDS/eDP 1.4
1 VGA
3
Resolutions up to 4K @ 30 Hz
NOTE
:
The conga-TS370 does not natively support TMDS. A DP++ to TMDS converter
(e.g. PTN3360D) needs to be implemented.
Peripheral
Interfaces
8x USB 2.0 (4 USB 3.1)
4x SATA
®
6 Gbps (with RAID 0/1/5/10 support)
8x PCI Express
®
Gen. 3 lanes
2x UART (16C550 compatible)
GPIOs/SDIO
LPC/eSPI
4
I²C (fast mode, multi-master)
SMB
SPI
BIOS
AMI Aptio
®
V UEFI 2.6 firmware
32 MB serial SPI flash with congatec Embedded BIOS features
Power
Management
ACPI 4.0a
compliant with battery support.
S5e mode (see section 7.1.7 “Enhanced Soft-Off State”)
Deep Sx and Suspend to RAM (S3)
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I²C
bus, power loss control
Security
Discrete SPI Trusted Platform Module (Infineon SLB9670_VQ2.0);
AES Instructions
