Copyright
©
2014
congatec
AG
TA30m16
11/95
1
Introduction
COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•
Mini
84 mm x 55 mm
•
Compact
95 mm x 95 mm
•
Basic
125 mm x 95 mm
•
Extended
155 mm x110 mm
Table 1
COM Express™ 2.1 Pinout Types
Types
Connector Rows
PCI Express Lanes PCI
IDE Channels
LAN ports
USB 2.0/ USB 3.0 Display Interfaces
Type 1
A-B
Up to 6
1
8 / 0
VGA, LVDS
Type 2
A-B C-D
Up to 22
32-bit
1
1
8 / 0
VGA, LVDS,PEG/SDVO
Type 3
A-B C-D
Up to 22
32-bit
3
8 / 0
VGA,LVDS,PEG/SDVO
Type 4
A-B C-D
Up to 32
1
1
8 / 0
VGA,LVDS,PEG/SDVO
Type 5
A-B C-D
Up to 32
3
8 / 0
VGA,LVDS,PEG/SDVO
Type 6
A-B C-D
Up to 24
1
8 / 4
VGA,LVDS,PEG, 3x DDI
Type 10
A-B
Up to 4
1
8 / 0
1x DDI
The conga-TCA3 modules use the Type 6 pinout definition and comply with COM Express 2.1 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM
modules provide most of the functional requirements for any application. These functions include, but are not limited to a rich complement
of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA, USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides
the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding the range of potential peripherals. The robust thermal and
mechanical concept, combined with extended power-management capabilities, is perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
