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9
GR-CPCIS-XCKU
Document Data Sheet & User Manual
Feb 2022, Version 1.2
4.2
Board Mechanical Format
The design is conceived as a 6U high, 1 slot wide module for mounting in the controller slot of a 6U
rack with a CPCI-S Backplane.
The dimensions of the main PCB are 233.35x160mm (excluding the connector protrusions).
The board can be fitted with a front-panel compatible with either a 20.32mm or 25.4mm wide
backplane pitch. The default panel is for a 25.4mm backplane pitch.
This prototype board is intended for installation in a rack with forced air cooling. However, for
installation in conduction cooled environment, a future design could accommodate standard
wedgeloks on the top and bottom rail edges of the board.
This would require the exact Wedge-lok type and mounting hole definition to be known, and the front
panel to be modified to accommodate them.
A standard FMC style (VITA 57.1) mezzanine interface connector allows an FMC -LPC Mezzanine
board to be mounted to the board.
The face to face mounting distance between the main board and mezzanine boards is 10mm. While
the prototype board is mounted using simple 10mm nickel-brass Hex spacers, a future design could
accommodate a custom aluminium bracket to act as a thermal interface between the two boards.
4.3
Xilinx Ultrascale FPGA
This board implements a large Xilinx Ultrscale FPGA, in a 1517 ball-grid-array package. The board
is initially designed to use a XCKU060 sized device, but is compatible with larger devices of the
same series which have the same footprint.
The
Xilinx Ultrascale FPGA
is a complex device with many modes of operation and features. For the
details of the interfaces, operation and programming, refer to the dedicated Xilinx documentation.
The assignment of the FPGA Logic banks is represented in Figure 4.
For detailed information about the signal and pin assignment of the FPGA, refer to [RD1].
The pin assignment has been performed taking into account the constraints described in the Xilinx
document ‘Radiation Tolerant Kintex UltraScaleXQRKU060 FPGA Data Sheet’ (DS882.pdf), which
would allow this board to also be populated with the FPGA version in a CNA1509 package instead
of the commercial FFVA1517 package.