Broadcom PLX PCI 9052RDK-LITE, Hardware Reference Manual

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3.9.1 BGA Prototyping
This RDK features a 26x26 @ 0.05” pitch BGA landscape with a plated-hole size of 0.022” di/-
0.001”. Users can prototype with BGA devices by using BGA to PGA adapters.
Referring to Figure 3-2, designers can use one of two methods to prototype with BGA devices. Both
methods require soldering the BGA device to a BGA Land Socket. The Land Socket can then be soldered
directly to the PC board or, optionally, a Minigrid Socket can be soldered to the board and the Land
Socket plugged into the Minigrid Socket.
These sockets are available from Ironwood Electronics (web site: www.ironwoodelectronics.com).
BGA Device
Ironwood BGA
Land Socket
Ironwood Minigrid
Socket (Optional)
RDK PCB
Solder
Plug
Solder
0.014"
0.018"
Figure 3-2. BGA to PGA Conversion
3.10 RDK Board Configuration
Table 3-4 Configuration Jumper Settings explains how to set the jumpers to configure the board. An “X” in
the Default Jumper column denotes the default jumper setting. The serial EEPROM is programmed to
enable Space 0 and Space 1 to operate in ISA mode by default.
PCI 9052RDK-LITE Hardware Reference Manual v1.3
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© 2004 PLX Technology, Inc. All rights reserved.