NO.
Operation name
Picture
Operation and note
7
Remove Speaker
Conductive Fabric,
Support Foam ,
Insulation Mylar
1:Remove TP_IC Conductive
Fabric with tweezers
2:Remove Speaker Conductive
Fabric with tweezers
3:Remove 2pcs Conductive Fabric
with tweezers
4:Remove 4PCS Conductive Foam
with tweezers
8
Remove TP-IC
Conductive Fabric
1:Remove TP-IC Conductive Fabric with
tweezers
2:Remove Front Camera Foam with
tweezers
2:Remove Front Camera flash seal
rubber with tweezers
9
Remove PCBA
Conductive fabric
,
Insulation Mylar
1
:
Remove the 2PCS Conductive Fabric
and Insulation Mylar
from the PCBA Board
with tweezers
Summary of Contents for Studio J1
Page 1: ...No 20160406 Studio J1 Service Manual...
Page 5: ...Chart 3 Explode view and Part list 3 1 Explode view...
Page 18: ...Chart 6 Soldering components for L2 repair Main PWB Top 6 1 Component layout...
Page 19: ...Chart 6 Soldering components for L2 repair 6 1 Component layout Main PWB Bottom...
Page 27: ...Chart 8 Main boards layout TOP...
Page 28: ...Bottom...
Page 30: ...Chart 9 Mobile working principle and Fault analysis 9 1 Mobile work principle...
Page 41: ......