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2.2 Module Layout
Figure 3 below shows the board dimension detail as seen from above. The overall thickness of the
board is 8.75mm. When considering the installation of this module, at least 9.5 mm height should be
provided, which will allow for the clearance of through-hole solder pins.
Figure 3. Board outline dimensions and mounting hole positions
The Jumpers NS0 through NS2 highlighted in Figure 4 are solder jumper pads to allow the user to fix
the Nosie Reduction level required. Care must be taken so as not to splash solder over un-used
solder pads when placing solder across the required jumpers.
Note: Ensure that any solder jumpers across these pads are removed before using the Remote Noise
Reduction control pins.
Figure 4. On-board Noise Reduction level selection jumpers
N0 solder
pad jumper
N1 solder
pad jumper
N2 solder
pad jumper
