Beckhoff CB6464, Manual

Page: 67 / 72

Technical data
CB6464 67 Version: 0.4
11.3 Technical specifications
The board is specified for an ambient temperature range of 0 °C to +60 °C (extended temperature range on
enquiry). In addition, care must be taken that the temperature of the processor die does not exceed 100 °C.
A suitable cooling concept must be implemented for this that is oriented to the maximum power consumption
of the processor/chipset. Please note: also that any existing controllers are included in the cooling concept.
The power consumption of these modules may be of the same order of magnitude as the power
consumption of the processor.
The board is prepared with suitable holes for the use of modern cooling solutions. We have a series of
compatible cooling components in our range. Your distributor will be glad to advise you on choosing suitable
solutions.
NOTE
Prevent the maximum die temperature being exceeded!
It is the end customer's responsibility to ensure that the die temperature of the processor does not exceed
100 °C! Continuous overheating can destroy the board!
If the temperature exceeds 100 °C, the ambient temperature needs to be reduced. Ensure sufficient air cir-
culation if necessary.