BCM Advanced Research
13
For the definition of A.G.P. Interface functionality (protocols, rules and signalling mechanisms, as well as the
platform aspect of A.G.P. functionality), refer to the latest A.G.P. Interface Specification. This document focuses
only on the Controller specifics of the A.G.P. interface functionality.
Embedded PCI Devices
The PCI bus contains 1 embedded PCI device: PCI bus mastering IDE interface. The arbiter within the PAC
performs arbitration for PCI bus masters.
PCI Bus Master IDE
PIIX-4 provides an integrated Bus Mastering IDE controller with two high performance IDE interfaces for up to
four devices, such as Hard Drives and CD-ROM.
PCI Add-in Cards
High Performance PCI I/O cards can be used in the IN440EX through the PCI connector slots. The PCI bus is
specified to support 10 loads. Each embedded controller or bridge (Video, PCI to ISA Bridge) count as 1 load,
each PCI expansion slot used counts as 2 loads. To support multiple PCI devices in a single slot, add an
expansion board containing PCI to PCI Bridge to a secondary PCI segment.
Embedded A.G.P. Devices
The AGP bus contains 1 embedded device: The ATI 3D Rage Pro Turbo 1X Graphics Accelerator. The 3D Rage
Pro is a highly integrated graphics controller, integrating the 2D, 3D and video accelerators, palette DAC and
quadruple clock synthesiser.
Embedded I/O Subsystem
The Winbond Plug and Play Ultra I/O controller “W83977TF” represents the newest technology in functionality
and integration. While providing the standard PC I/O requirements the Ultra I/O complies with the ISA Plug-and-
Play standard version 1.0a, and provides for the recommended functionality to support Windows 95. The Ultra
I/O qualifies 16-bit address to allow relocation of 480 different addresses, with 13 IRQ options and 3 DMA
channels available for each logical device.
Other features of the Ultra I/O are: 8042 keyboard controller. An Infrared interface for Fast IR (FIR), IrDA and
ASKIR. Floppy interface. Two serial ports with 16-byte FIFOs. One EPP/ECP supported bi-directional parallel
port.
System Management Subsystem
The IN440EX support the System Monitor services using Winbond’s W83781D System Management chip. The
W83781D is used to monitor Voltage, Temperature, Fan Speed and Open Case Intrusion. The combination of the
System Monitor and the Wake On LAN (WOL) functionality achieves the Management Level 3.
Advanced Configuration and Power Interface “ACPI”
