Technical data • Complete system
Chapter 2
Technical data
Power Panel 500 user's manual V1.40
23
2 Complete system
2.1 Temperature specifications
It is possible to combine CPU boards with various other components, such as main memory, I/O boards, interface
boards, etc. depending on the system unit. The various configurations result in varying maximum possible ambient
temperatures, which can be seen in the following table.
Information:
The maximum specified ambient temperatures for operation were determined under worst-case condi-
tions. Experience has shown that higher ambient temperatures can be reached in typical applications,
e.g. those in Microsoft Windows. Testing and evaluation must be performed on-site by the user (tem-
peratures can be read in BIOS or with the B&R Control Center).
Information regarding worst-case conditions
•
Thermal Analysis Tool (TAT V2.02) from Intel for simulating a 100% processor load
•
BurnInTest tool (BurnInTest V4.0 Pro from Passmark Software) for simulating a 100% load on the interface
via loop back adapters (serial interfaces, USB ports)
•
Maximum system expansion and power consumption
2.1.1 Temperature monitoring
Sensors monitor temperature values at various places inside the PP500 (CPU, interfaces, display, interface board,
I/O board). The location of these temperature sensors is illustrated in "Temperature sensor locations" on page
24. The values listed in the table represent the defined maximum temperature
1)
for the respective measurement
point. An alarm is not triggered if this temperature is exceeded. These temperatures can be read in BIOS or in
approved Microsoft Windows operating systems together with Automation Runtime and the B&R Control Center.
1)
The temperature measured approximates the immediate ambient temperature but may also be influenced by neighboring components.
