548
8271D–AVR–05/11
ATmega48A/PA/88A/PA/168A/PA/328/P
34. Packaging Information
34.1
32A
2
3
25 Orch
a
rd P
a
rkw
a
y
Sa
n Jo
s
e, CA
9
51
3
1
TITLE
DRAWING NO.
R
REV.
3
2A,
3
2-le
a
d, 7 x 7 mm Body
S
ize, 1.0 mm Body Thickne
ss
,
0.
8
mm Le
a
d Pitch, Thin Profile Pl
as
tic Q
ua
d Fl
a
t P
a
ck
a
ge (TQFP)
C
3
2A
2010-10-20
PIN 1 IDENTIFIER
0°~7°
PIN 1
L
C
A1
A2
A
D1
D
e
E1
E
B
Note
s
:
1.
Thi
s
p
a
ck
a
ge conform
s
to JEDEC reference M
S
-026, V
a
ri
a
tion ABA.
2.
Dimen
s
ion
s
D1
a
nd E1 do not incl
u
de mold protr
us
ion. Allow
ab
le
protr
us
ion i
s
0.25 mm per
s
ide. Dimen
s
ion
s
D1
a
nd E1
a
re m
a
xim
u
m
pl
as
tic
b
ody
s
ize dimen
s
ion
s
incl
u
ding mold mi
s
m
a
tch.
3
. Le
a
d copl
a
n
a
rity i
s
0.10 mm m
a
xim
u
m.
A
–
–
1.20
A1
0.05
–
0.15
A2
0.
9
5
1.00
1.05
D
8
.75
9
.00
9
.25
D1
6.
9
0 7.00 7.10
Note
2
E
8
.75
9
.00
9
.25
E1
6.
9
0 7.00 7.10
Note
2
B 0.
3
0 – 0.45
C
0.0
9
– 0.20
L
0.45
–
0.75
e
0.
8
0 TYP
COMMON DIMEN
S
ION
S
(Unit of Me
asu
re = mm)
S
YMBOL
MIN
NOM
MAX
NOTE