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of memory and accessing columns within it.
Row Precharge: The number of clock cycles required between the issuing of the precharge
command and opening the next row.
RAS# Active Time (tRAS)
The number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
The delay between when a memory chip is selected and when the first active command can
be issued.
Secondary Timing
Write Recovery Time (tWR)
The amount of delay that must elapse after the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time 2 (tRFC2)
The number of clocks from a Refresh command until the first Activate command to
the same rank.
Refresh Cycle Time per Bank (tRFCpb)
The number of clocks that a per back Refresh command takes to complete.
RAS to RAS Delay (tRRD_L)
The number of clocks between two rows activated in different banks of the same
rank.
RAS to RAS Delay (tRRD_S)
The number of clocks between two rows activated in different banks of the same
rank.
Read to Precharge (tRTP)
The number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
The time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Configure CAS Write Latency.