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2
1.2 Specifications
Platform
•
ATX Form Factor
•
8 Layer PCB
•
2oz Copper PCB
CPU
•
Supports Intel® Core
TM
X-Series Processor Family for the
LGA 2066 Socket
(Cascade Lake-X, Skylake X Refresh and
Skylake X)
•
Digi Power design
•
13 Power Phase design
•
Supports Intel® Turbo Boost Max Technology 3.0
•
Supports ASRock Hyper BCLK Engine III
Chipset
•
Intel® X299
Memory
•
Quad Channel DDR4 Memory Technology
•
8 x DDR4 DIMM Slots
•
Supports DDR4 4200+(OC)*/4133(OC)/4000(OC)/3866(OC)
/3800(OC)/3733(OC)/3600(OC)/3200(OC)/2933(OC)/2800
(OC)/2666/2400/2133 non-ECC, un-buffered memory
* The maximum memory frequency supported may vary by
processor type.
* Please refer to Memory Support List on ASRock’s website for
more information. (http://www.asrock.com/)
•
Max. capacity of system memory: 256GB
•
Supports Intel® Extreme Memory Profile (XMP) 2.0
•
15μ Gold Contact in DIMM Slots
Expansion
Slot
•
4 x PCI Express 3.0 x16 Slots*
* If you install CPU with 48 lanes, PCIE1/PCIE2/PCIE3/PCIE5
will run at x16/x8/x16/x8.
If a M.2 PCI Express module is installed on M2_1 or M2_2,
PCIE2 will downgrade to x4 mode.
If M.2 PCI Express modules are installed on M2_1 and M2_2,
PCIE2 will be disabled.
* If you install CPU with 44 lanes, PCIE1/PCIE2/PCIE3/PCIE5
will run at x16/x4/x16/x8.
If a M.2 PCI Express module is installed on M2_1, PCIE2 will
be disabled.
