6
1.2
Specifications
Platform
- Micro ATX Form Factor: 8.9-in x 6.8-in, 22.6 cm x 17.3 cm
- Solid Capacitor for CPU power
CPU
- Supports 3
rd
and 2
nd
Generation Intel
®
Core
TM
i7 / i5 / i3 in
LGA1155 Package
- Supports Intel
®
Turbo Boost 2.0 Technology
- Supports K-Series unlocked CPU
- Supports Hyper-Threading Technology (see
CAUTION 1
)
Chipset
- Intel
®
H61
- Supports Intel
®
Rapid Start Technology and Smart Connect
Technology
Memory
- Dual Channel DDR3 Memory Technology (see
CAUTION 2
)
- 2 x DDR3 DIMM slots
- Supports DDR3 1600/1333/1066 non-ECC, un-buffered
memory (DDR3 1600 with Intel
®
Ivy Bridge CPU, DDR3
1333 with Intel
®
Sandy Bridge CPU)
- Max. capacity of system memory: 16GB (see
CAUTION 3
)
- Supports Intel
®
Extreme Memory Profile (XMP) 1.3 / 1.2 with
Intel
®
Ivy Bridge CPU
Expansion Slot
- 1 x PCI Express 3.0 x16 slot (blue @ x16 mode)
* PCIE 3.0 is only supported with Intel
®
Ivy Bridge CPU. With
Intel
®
Sandy Bridge CPU, it only supports PCIE 2.0.
- 1 x PCI Express 2.0 x1 slot
Graphics
* Intel
®
HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU
integrated.
- Supports Intel
®
HD Graphics Built-in Visuals: Intel
®
Quick
Sync Video 2.0, Intel
®
Clear Video HD Technology, Intel
®
Insider
TM
, Intel
®
HD Graphics 2500/4000 with Intel
®
Ivy
Bridge CPU
- Supports Intel
®
HD Graphics Built-in Visuals: Intel
®
Quick
Sync Video, Intel
®
Clear Video HD Technology, Intel
®
HD
Graphics 2000/3000, Intel
®
Advanced Vector Extensions
(AVX) with Intel
®
Sandy Bridge CPU
- Pixel Shader 5.0, DirectX 11 with Intel
®
Ivy Bridge CPU.
Pixel Shader 4.1, DirectX 10.1 with Intel
®
Sandy Bridge
CPU.
- Max. shared memory 1760MB with Intel
®
Ivy Bridge CPU.
Max. shared memory 1759MB with Intel
®
Sandy Bridge
CPU. (see
CAUTION 4
)
Summary of Contents for H61M-VGS R2.0
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