UG-1067
EVAL-ADGS1412SDZ User Guide
Rev. 0 | Page 12 of 12
ORDERING INFORMATION
BILL OF MATERIALS
Table 4.
Reference Designator
Description
C1 to C2
50 V tantalum capacitor, 10 µF, D size
C3 to C6, C8
50 V, X7R multilayer ceramic capacitor, 0.1 µF, 0603
C7
Capacitor, 10 µF, 0805, 16 V
D1 to D4
Not placed
S1 to S4
Not placed
T1 to T8
Red test point
GND1, GND2
Black test point
J1 to J3
4-pin terminal block, 5 mm pitch
J4
120-way connector, 0.6 mm pitch
J5
Through hole, header, 4 × 2, 2.54 mm
LK1, LK2
3-pin SIL header and shorting link
R2 to R7, R12 to R15, R17, R18, R21, R22, R27, R28, R32, R34, R35
Not placed
R8 to R11, R16, R19, R20, R23 to R26, R33
Resistor, 0 Ω, 0603, 1%
R1
Resistor, 10 kΩ, 0.063 W, 1%, 0603
R29
Resistor, 1 kΩ, 0.063 W, 1%, 0603
R30, R31
Resistor, 100 kΩ, 0.063 W, 1%, 0603
SW1
SMD push button switch
U1
, SPI controlled, quad SPST switch
U2
, 1.8 V to 5.5 V, 2:1 multiplexer/SPDT switch
U3
32 kΩ, I
2
C serial EEPROM
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
ESD Caution
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection
circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality.
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UG15129-0-10/16(0)
