Rockwell Automation Publication 2097-UM001D-EN-P - November 2012
65
Connecting the Kinetix 300 Drive System
Chapter 4
Figure 39 - Chassis Ground Configuration (multiple Kinetix 300 drives on one panel)
Ground Multiple Subpanels
To ground multiple subpanels, see the figure below. HF bonding is not
illustrated. For information, see
Figure 40 - Subpanels Connected to a Single Ground Point
Power Wiring Requirements
Wire should be copper with 75 °C (167 °F) minimum rating. Phasing of main
AC power is arbitrary and earth ground connection is required for safe and
proper operation.
for interconnect diagrams.
Bonded Ground Bar
(optional)
Bonded Cabinet
Ground Bus
Ground Grid or Power
Distribution Ground
Always follow NEC and
applicable local codes.
Chassis Ground
Chassis Ground
Chassis Ground
Chassis Ground
Always follow NEC and
applicable local codes.
Ground Grid or Power
Distribution Ground
Bonded Ground
Bus
IMPORTANT
The National Electrical Code and local electrical codes take precedence over the
values and methods provided.