
Rockwell Automation Publication 8720MC-RM001K-EN-P - September 2018
45
Connect the 8720MC-RPS Unit
Chapter 5
Ground Multiple Subpanels
In this figure, the chassis ground is extended to multiple subpanels.
Figure 21 - Subpanels Connected to a Single Ground Point
High-frequency (HF) bonding is not illustrated. For HF bonding information,
refer to
on
Follow NEC and applicable
local codes.
Bonded Ground Bus
Ground Grid or Power
Distribution Ground