2
XP-ZV700/ZV701/ZV702
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
.OTESONTHE!#POWERADAPTOR
s $ISCONNECTALLPOWERSOURCESWHENTHEPLAYERIS
NOTTOBEUSEDFORALONGTIME
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bbreviation
!#POWERADAPTOR
Except
:6
: AEP
MODEL
*
%ARPHONE
s
:6
:
%
,
HK, AUS
and ZV701: E18 models only
*
)
2EMOTE
:6
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MODEL
2ECHARGEABLEBATTERY
"ATTERYCARRYINGCASE
:6
:
%MODEL
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:
%MODEL
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*
#$2/-3ONIC3TAGE
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)NSTALLATION/PERATING'UIDE
*
&ORTHEAREACODEOFTHEMODELYOUPURCHASED
CHECKTHEUPPERLEFTSIDEOFTHEBARCODEONTHE
PACKAGE
(Other models)
%ARPHONE
s
ONLY
*
Clamp filter
ONLY
*
:6
1: E18 and ZV702 models only*)
Supplied Accessories
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
3
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
6
3-2.
Cabinet (Upper) Assy, Cabinet (Lower) ..........................
6
3-3.
JACK Board, Optical Pick-up Assy (CDM-3325ERV) ...
7
3-4.
SWITCH Board ...............................................................
7
4.
DIAGRAMS
4-1.
Printed Wiring Board – EGL Board – ............................
9
4-2.
Schematic Diagram – EGL Board – ............................... 10
4-3.
Printed Wiring Board
– JACK Board (Component Side) – ................................ 11
4-4.
Printed Wiring Board
– JACK Board (Conductor Side) – .................................. 12
4-5.
Schematic Diagram – JACK Board – ............................. 13
4-6.
Printed Wiring Board – SWITCH Board – .................... 14
4-7.
Schematic Diagram – SWITCH Board – ....................... 15
5.
EXPLODED VIEWS
5-1.
Cabinet (Upper) Section .................................................. 23
5-2.
Cabinet (Upper) Assy Section ......................................... 24
5-3.
Cabinet (Lower) Section .................................................. 25
5-4.
Optical Pick-up Section (CDM-3325ERV) ..................... 26
6.
ELECTRICAL PARTS LIST
.................................. 27
AR: Argentina model
AUS: Australian and New Zealand model
E18: Singapore model
HK: Hong Kong model
MX: Mexican model