CX-JE3
22
22
Ref. No.
Location
• Semiconductor Location
IC721
D-8
IC722
C-9
IC801
E-3
IC802
F-3
IC803
F-9
Q701
B-7
6-5.
PRINTED WIRING BOARD – BD Section –
•
See page 21 for Circuit Boards Location.
:Uses unleaded solder.
C860
R860
FB803
FB805
FB804
FB806
R806
R807
R747
C901
C902
R746
BD BOARD
(COMPONENT SIDE)
1-688-077-
(11)
11
OPTICAL
PICK-UP
BLOCK
(KSM-213DCP)
IC803
BD BOARD
(CONDUCTOR SIDE)
1-688-077-
(11)
11
M702
(SPINDLE)
M
+
–
M701
(SLED)
M
+
–
S701
(LIMIT IN)
TP
(RF)
TP
(FE)
TP
(TE)
TP
(VC)
E
B
C
A
B
C
D
E
F
1
2
3
4
5
6
7
8
9
10
11
Summary of Contents for CX-JE3
Page 67: ...65 CX JE3 MEMO ...