MIO-2270 User Manual
18
2.3.2.3
Another Thermal Solution - Heat Spreader
MIO-2270 can accommodate an optional heat spreader for a more comprehensive
compact system. Conducting heat to the chassis using a heat spreader is extremely
beneficial when systems are extra compact or have limited space for heat convec-
tion. Guidelines for heat spreaders are provided below:
1.
For optimal heat conduction, minimize the gap between the chassis and heat
spreader; the smaller the gap, the better.
2.
The default heat spreader height is 11.2 mm (Advantech P/N:
1960065075N001). However, if a different height is required to better fit the
chassis, Advantech can customize the heat spreader according to your needs.
Please contact our sales center for further information.
3.
The heat spreader kit contains thermal grease and screws. If the chassis is
positioned near the heat spreader, thermal grease can be applied to enhance
conduction. Alternatively, if the chassis is positioned far from the heat spreader,
a thermal pad should be employed. A gap of less than 3 mm is recommended
for superior heat conduction.
Figure 2.11 Heat spreader assembly
Summary of Contents for MIO-2270
Page 9: ...MIO 2270 User Manual viii...
Page 30: ...Chapter 3 3 BIOS Settings...
Page 52: ...Chapter 4 4 S W Introduction and Installation...
Page 64: ...Appendix A A Pin Assignments...
Page 74: ...63 MIO 2270 User Manual Appendix A Pin Assignments...
Page 76: ...65 MIO 2270 User Manual Appendix A Pin Assignments...
Page 78: ...67 MIO 2270 User Manual Appendix A Pin Assignments...
Page 85: ...MIO 2270 User Manual 74...
Page 86: ...Appendix B B WDT and GPIO...
Page 89: ...MIO 2270 User Manual 78...
