
6
Introduction
Leading
EDGE COMPUTING
1.5
Thermal Specification
1.5.1
Heat Sink Specifications
Heat sink designation is based on open frame locations such as
kiosk installation. For Panel PC, design concept will differ.
1.5.2
Routing Considerations
Cable routing should avoid high temperature areas as follows.
CPU
CPU TDP
Part
Material
Dimensions
(mm)
E3930
6W
CPU heat sink AL6063
72x67x6.01
E3950
12W
79x102x48.2
1
CPU
2
Power
3
Memory
1
2
3
Summary of Contents for SP-AL
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Page 14: ...xiv List of Tables Leading EDGE COMPUTING This page intentionally left blank...
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Page 24: ...8 Introduction Leading EDGE COMPUTING Figure 1 2 10 1 Panel Left Side View 51 2...
Page 25: ...Introduction 9 SP AL 1 6 2 12 1 Panel Figure 1 3 12 1 Panel Front View 301 72 203 80...
Page 26: ...10 Introduction Leading EDGE COMPUTING Figure 1 4 12 1 Panel Left Side View 53 5...
Page 27: ...Introduction 11 SP AL 1 6 3 15 6 Panel Figure 1 5 15 6 Panel Front View 388 83 238 14...
Page 28: ...12 Introduction Leading EDGE COMPUTING Figure 1 6 15 6 Panel Left Side View 53 29...
Page 29: ...Introduction 13 SP AL 1 6 4 18 5 Panel Figure 1 7 18 5 Panel Front View 454 40 275...
Page 30: ...14 Introduction Leading EDGE COMPUTING Figure 1 8 18 5 Panel Left Side View 57 30...
Page 31: ...Introduction 15 SP AL 1 6 5 21 5 Panel Figure 1 9 21 5 Panel Front View 521 24 312 71...
Page 32: ...16 Introduction Leading EDGE COMPUTING Figure 1 10 21 5 Panel Left Side View 57 50...
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Page 58: ...42 Getting Started Leading EDGE COMPUTING...
Page 61: ...Getting Started 45 SP AL...
Page 81: ...BIOS Setup 65 SP AL...
Page 87: ...BIOS Setup 71 SP AL A 2 9 Network Stack Configuration Enables disables UEFI network stack...
Page 92: ...76 BIOS Setup Leading EDGE COMPUTING A 3 Chipset...
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Page 110: ...94 Important Safety Instructions Leading EDGE COMPUTING This page intentionally left blank...