INTRODUCTION
6 - 1
SECTION 6 - REPAIR/REPLACEMENT AND UPGRADE
INTRODUCTION
This section provides special handling procedures for MOS devices,
battery pack replacement, upgrade information and a list of recom-
mended spare parts for the STT04 terminal.
SPECIAL HANDLING GUIDLINES FOR MOS DEVICES
Metal oxide semiconductor (MOS) devices are subject to damage by
static electricity. Observe the following techniques while servicing and
troubleshooting.
1. Most assemblies with MOS devices are shipped in a special anti-
static bag. Keep the assembly in the bag as much as possible when-
ever the assembly is not in the system.
2. Remove assemblies containing MOS devices from their antistatic
protective container only under the following conditions:
a. When at a static-free work station or when the bag is
grounded at the field site.
b. After neutralizing the conductive area of the container.
c. Only after firm contact with an antistatic mat and/or firmly
gripped by a grounded individual.
3. Personnel handling assemblies with MOS devices should be neu-
tralized to a static-free work station by a grounding wrist strap that is
connected to the station or to a good ground point at the field site.
4. Do not allow clothing to make contact with MOS devices. Most
clothing generates static electricity.
5. Avoid touching edge connectors and components.
6. Avoid partial connection of MOS devices. Damage can occur by
floating leads, especially the power supply connector. If inserting an
assembly into a live system, do so quickly. Do not cut leads or lift cir-
cuit paths when troubleshooting.
7. Be sure test equipment is grounded.
