ABB Relion 670 series, Technical Manual

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Name Type Default Description
BO8 BOOLEAN 0 Signal name for BO8 in Signal Matrix Tool
BO9 BOOLEAN 0 Signal name for BO9 in Signal Matrix Tool
BO10 BOOLEAN 0 Signal name for BO10 in Signal Matrix Tool
21.7.4 Operation principle
SEMOD55864-4 v6
The Signal matrix for binary outputs (SMBO) function , see figure 636 , receives logical signal from
the IED configuration, which is transferring to the real (hardware) outputs, via the Signal Matrix
Tool (SMT). The inputs in SMBO are BO1 to BO10 and they, as well as the whole function block, can
be tag-named. The name tags will appear in SMT as information which signals shall be connected
between physical IO and the SMBO.
21.8 Signal matrix for mA inputs SMMI
SEMOD55233-1 v2
21.8.1 Functionality
SEMOD55902-4 v6
The Signal matrix for mA inputs (SMMI) function is used within the Application Configuration Tool
(ACT) in direct relation with the Signal Matrix Tool (SMT). See the Application Manual for
information about how milliamp (mA) inputs from external transducers are physically connected
to the MIM board inputs used in an IED. Via the SMMI, the signals are brought into the IED
configuration, for example, to the input for ambient temperature compensation of the thermal
overload function when there is a need for ambient temperature compensation in the thermal
function.
21.8.2 Function block
SEMOD54866-4 v3
SMMI
^AI1
^AI2
^AI3
^AI4
^AI5
^AI6 ^AI1
^AI2
^AI3
^AI4
^AI5
^AI6
IEC05000440.vsd
IEC05000440 V3 EN-US
Figure 637: SMMI function block
21.8.3 Signals
SEMOD55924-1 v2
PID-3832-INPUTSIGNALS v4
Table 979: SMMI Input signals
Name Type Default Description
AI1 REAL 0 SMT connected milliampere input
AI2 REAL 0 SMT connected milliampere input
AI3 REAL 0 SMT connected milliampere input
Table continues on next page
Section 21 1MRK 502 066-UUS B
Basic IED functions
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Technical manual