128 SBC329 3U VPX Single Board Computer
Publication No. SBC329-HRM/1
B •
Thermal Derating
The processor speed and the temperature are inter-dependent. This means that for a
given temperature, a maximum processor speed is achievable before throttling, and
conversely for a given processor speed before throttling, a maximum temperature is
achievable. This is further affected by the build level, which dictates the maximum
ambient temperature at which the board can operate (see the
This appendix shows the measured maximum values for the SBC329.
NOTE
The following data is subject to change as new thermal solutions are developed.
Contact Abaco for the latest thermal derating figures.
B.1 Processor Option 4: Standard
Product codes are of the form SBC329-y4xxxxxxx, where
“
y
”
is the build level and
“4” selects the standard processor (1505M, 45W). S
details of the other options.
Table B-1 Maximum Processor Speed versus Maximum Temperature for Processor Option 4
Build
Level
(y)
Maximum CPU Rating at
Maximum Operating Temperature
Maximum Operating Temperature
at Maximum CPU Rating
Heat
Dissipation
Method
Temperature Frequency
Frequency
Temperature
1
55
˚C
2.8 GHz (estimated) 3.0
GHz
55
˚C
(estimated)
300 lfm blown air
2
65
˚C
2.5 GHz (estimated) 3.0
GHz
55
˚C
(estimated)
3
75
˚C
2.1 GHz (estimated) 3.0
GHz
55
˚C
(estimated)
600 lfm blown air
4
75
˚C
2.1 GHz (estimated) 3.0
GHz
55
˚C
(estimated)
Card edge
5
85
˚C
1.5 GHz (estimated) 3.0
GHz
55
˚C
(estimated)
NOTES
The thermal data for the above table was determined while the units were running multi-
threaded test software used to stress CPU, memory and I/O functions simultaneously. This test
load is generally heavier than a standard embedded application. There may be some variance in
users’ thermal results based on the end application.
No XMCs were fitted to the units used in determining the above figures. Fitting an XMC could
decrease the maximum frequency/temperature achievable by the SBC329, depending on the
XMC’s pow
er dissipation and thermal solution.
