background image

TPC8402 

2006-11-13 

1

TOSHIBA Field Effect Transistor    Silicon N, P Channel MOS Type (

π−

MOS

VI

/U

MOSII)  

TPC8402

 

 

Lithium-Ion Secondary Battery Applications 
Notebook PCs 
Portable Equipment Applications 

 
 

z

 

Low drain

source ON resistance : P Channel R

DS

 

(ON)

 = 27 m

 (typ.) 

 

  N Channel R

DS

 

(ON)

 = 37 m

 (typ.) 

z

 

High forward transfer admittance : P Channel |Y

fs

| = 7 S (typ.) 

 

  N Channel |Y

fs

| = 6 S (typ.) 

z

 

Low leakage current : P Channel I

DSS

 = 

10 µA (V

DS

 = 

30 V) 

 

  N Channel I

DSS

 = 10 µA (V

DS

 = 30 V) 

z

 

Enhancement

mode 

  : P Channel V

th

 = 

0.8~ 

2.0 V (V

DS

 = 

10 V, I

D

 = 

1mA) 

    N Channel V

th

 = 0.8~2.0 V (V

DS

 = 10 V, I

D

 = 1mA) 

 

Absolute Maximum Ratings 

(Ta = 25°C) 

Rating 

Characteristics Symbol

P Channel N Channel

Unit

Drain-source voltage 

V

DSS

 

30 30 V 

Drain-gate voltage (R

GS

 

=

 20 k

) V

DGR

 

30 30 V 

Gate-source voltage 

V

GSS

 ±20 

±20  V 

DC (Note 

1) 

I

D

 

4.5 5 

Drain current 

Pulse (Note 

1) 

I

DP

 

18 20 

Single-device operation

 

 (Note 

3a) 

P

D (1)

 1.5 

1.5 

Drain power 
dissipation 

(t = 10s) 
 (Note 

2a) 

Single-device value at 
dual operation

 

(Note 3b) 

P

D (2)

 1.0 

1.0 

Single-device operation

 

 (Note 

3a) 

P

D (1)

 0.75  0.75 

Drain power 
dissipation 

(t = 10s) 
 (Note 

2b) 

Single-device value at 

dual operation

 

(Note 3b) 

P

D (2)

 0.45  0.45 

Single-pulse avalanche energy 

E

AS

 

26.3 

(Note 4a)

32.5 

(Note 4b)

mJ 

Avalanche current 

I

AR

 

4.5 5 A 

Repetitive avalanche energy 

Single-device value at operation 
 

(Note 2a, Note 3b, Note 5) 

E

AR

 0.10  mJ 

Channel temperature 

T

ch

 150  °C 

Storage temperature range 

T

stg

 

55~150 °C 

Note:  For Notes 1 to 5, see the next page.   

 

Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the 
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even 
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum 
ratings. 
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook 
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report 
and estimated failure rate, etc). 

This transistor is an electrostatic-sensitive device. Handle with care. 

 

Unit: mm

 

 

JEDEC 

 

JEITA 

 

TOSHIBA 2-6J1E 

Weight: 0.080 g (typ.) 

 

Circuit Configuration 

 

 

 

Summary of Contents for TPC8402

Page 1: ...e operation Note 3a PD 1 0 75 0 75 Drain power dissipation t 10s Note 2b Single device value at dual operation Note 3b PD 2 0 45 0 45 W Single pulse avalanche energy EAS 26 3 Note 4a 32 5 Note 4b mJ Avalanche current IAR 4 5 5 A Repetitive avalanche energy Single device value at operation Note 2a Note 3b Note 5 EAR 0 10 mJ Channel temperature Tch 150 C Storage temperature range Tstg 55 150 C Note ...

Page 2: ...lues shown are for a single device During single device operation power is applied to one device only b The power dissipation and thermal resistance values shown are for a single device During dual operation power is applied to both devices evenly Note 4 a VDD 24 V Tch 25 C Initial L 1 0 mH RG 25 Ω IAR 4 5 A b VDD 24 V Tch 25 C Initial L 1 0 mH RG 25 Ω IAR 5 0 A Note 5 Repetitive rating pulse widt...

Page 3: ...V ID 2 2 A 27 35 mΩ Forward transfer admittance Yfs VDS 10 V ID 2 2 A 3 5 7 S Input capacitance Ciss 970 Reverse transfer capacitance Crss 180 Output capacitance Coss VDS 10 V VGS 0 V f 1 MHz 370 pF Rise time tr 17 Turn on time ton 20 Fall time tf 75 Switching time Turn off time toff 160 ns Total gate charge gate source plus gate drain Qg 28 Gate source charge 1 Qgs1 6 Gate drain miller charge Qgd...

Page 4: ...A 37 50 mΩ Forward transfer admittance Yfs VDS 10 V ID 2 5 A 3 6 S Input capacitance Ciss 475 Reverse transfer capacitance Crss 85 Output capacitance Coss VDS 10 V VGS 0 V f 1 MHz 270 pF Rise time tr 10 Turn on time ton 16 Fall time tf 13 Switching time Turn off time toff 70 ns Total gate charge gate source plus gate drain Qg 16 Gate source charge 1 Qgs1 11 Gate drain miller charge Qgd VDD 24 V VG...

Page 5: ...TPC8402 2006 11 13 5 P ch Drain current ID A RDS ON ID Drain source voltage R DS ON mΩ VGS 4 V VGS 10 V 0 1 1 100 10 100 5 30 50 10 0 3 3 30 300 500 Common source Ta 25 C Pulse test ...

Page 6: ...E OPERATION NOTE 3a 2 SINGLE DEVICE VALUE AT DUAL OPERATION NOTE 3b DEVICE MOUNTED ON A GLASS EPOXY BOARD b NOTE 2b 3 SINGLE DEVICE OPERATION NOTE 3a 4 SINGLE DEVICE VALUE AT DUAL OPERATION NOTE 3b t 10 s Ambient temperature Ta C RDS ON Ta Drain source ON resistance R DS ON mΩ 80 40 0 40 80 160 120 0 20 40 60 80 Common source Pulse test 2 2 A ID 4 5 A 1 3 A ID 4 5 A 2 2 A 10 V 1 3 A VGS 4 V ...

Page 7: ... 1 0 3 0 5 3 5 10 30 50 100 300 1000 500 DEVICE MOUNTED ON A GLASS EPOXY BOARD a NOTE 2a 1 SINGLE DEVICE OPERATION NOTE 3a 2 SINGLE DEVICE VALUE AT DUAL OPERATION NOTE 3b DEVICE MOUNTED ON A GLASS EPOXY BOARD b NOTE 2b 3 SINGLE DEVICE OPERATION NOTE 3a 4 SINGLE DEVICE VALUE AT DUAL OPERATION NOTE 3b 1 SINGLE PULSE 2 3 4 ...

Page 8: ...TPC8402 2006 11 13 8 N ch ...

Page 9: ... 100 150 200 0 5 1 0 1 5 2 0 4 3 DEVICE MOUNTED ON A GLASS EPOXY BOARD a NOTE 2a 1 SINGLE DEVICE OPERATION NOTE 3a 2 SINGLE DEVICE VALUE AT DUAL OPERATION NOTE 3b DEVICE MOUNTED ON A GLASS EPOXY BOARD b NOTE 2b 3 SINGLE DEVICE OPERATION NOTE 3a 4 SINGLE DEVICE VALUE AT DUAL OPERATION NOTE 3b t 10 s ...

Page 10: ... 1 0 3 0 5 3 5 10 30 50 100 300 1000 500 DEVICE MOUNTED ON A GLASS EPOXY BOARD a NOTE 2a 1 SINGLE DEVICE OPERATION NOTE 3a 2 SINGLE DEVICE VALUE AT DUAL OPERATION NOTE 3b DEVICE MOUNTED ON A GLASS EPOXY BOARD b NOTE 2b 3 SINGLE DEVICE OPERATION NOTE 3a 4 SINGLE DEVICE VALUE AT DUAL OPERATION NOTE 3b 1 SINGLE PULSE 2 3 4 ...

Page 11: ...s are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications Also please keep in mind the precautions and conditions set forth in the Handling Guide for Semiconductor Devices or TOSHIBA Semiconductor Reliability Handbook etc The TOSHIBA products listed in this document are intended for usage in general electronics applications computer personal equip...

Reviews: